b'Geek Hub | Engineer InnovationC Selected Goals300T=300.00s250200150100250 25 50 75 100 150 200 250 300TimeFigure 2: Temperature against time for egg cooled CPU Figure 3: Temperature surface plot of egg after five minutes of heatingSolving complex thermal models withtexture onto the board. This allowed CFD requires a lot of processing powerthe footprints of the board and a CPU under full load generates acomponents to be positioned fair amount of heat. But can you cookaccurately against the image.an egg on it? Search online and you can find videos of people attempting toAn excessively detailed board is not cook on their processors, but hownecessary for this model as we are effective as a cooling solution is this?only interested in the CPU Before you throw away yourtemperature. To do this, the model conventional heatsink and fan, in favorneeds to include the major sources of of a multifunctional omelette, wellheat and any geometry that may alter investigate what CFD in Simcenterthe flow of air around critical Flotherm XT software can predictcomponents. The geometry around about the fate of your PC if you do so. the CPU, such as the CPU socket, needs to be much more detailed as this has a Model significant effect on heat transfer by As a student intern at Mentor, aconduction. The CPU itself is modeled Siemens Business I get the opportunitywith accurate geometry and a two-to create and play with interesting andresistor network assembly thermal unusual thermal models made in themodel, based on an Intel Core software. For this concept, I started byi3-4130 as a representative mid-creating a very basic projectrange desktop processor. Typical comprising two cuboids and a cylindermaximum Tjunc and Tcase are to model a motherboard, processor90C and 72C.[1] The geometry and egg. Then I did some research far from the CPU, such as the I/O standard dimensions for motherboards,ports, can be modeled as simple CPU thermal design power (TDP),cuboids that will present an thermal data for eggs. obstacle to air flow on that edge of the board. Additional detail Using this very simple model, I waswould just prolong the solver able to test things rapidly, get a roughcomputation time with diminutive feel for the range of temperatures andimprovement in accuracy.evaluate how feasible the concept was to model. LimitationsOne consideration is that the egg I then created a more detailed model,cannot quite be simplified to a starting by importing a board usingmaterial with thermal FLOEDA Bridge, a tool in Simcenterproperties dependent on Flotherm XT that allows 3D CADtemperature, which geometry to be produced from anSimcenter Flotherm XT is intuitive 2D EDA environment. Using aeasily capable of modeling. topographical image of aFor instance, apply heat to a representative mITX motherboard andblock of aluminum and that a selection of known dimensions, I wasenergy will all eventually be able to accurately scale the image as atransferred to the ambient air 63'