b'Electronics & Semiconductor | Engineer InnovationFlotherm model of the IC package.saves time, effort and cost compared to Examples of a HFCBGA (Figure 5) andcreating and testing physical QFN package are shown in Figure 6. prototypes.Simcenter Flotherms auto-calibrationFinally a dynamic compact thermal module is integrated into Commandmodel (DCTM) can also be obtained Center (used for What-If, Design offrom the Simcenter T3STER-Master Experiments, and Design Optimizationanalysis software after analyzing the studies). By nominating the differentmeasured junction temperatures. This design variables for optimization, theDCTM model will be in the form of a R-C simulation model can be automaticallyladder network model, as shown in adjusted to match the measuredFigure 7.structure function. A calibrated Simcenter Flotherm model of the ICThe DCTM predicts temperatures at the package gives confidence of its accurateimportant nodes in the model, e.g. steady state and transient behavior.Junction, Case, Board. Crucially, the geometry of the internal design and With a calibrated Simcenter Flothermother proprietary information is kept model it is quick and easy to carry outconfidential and the grid count for this design studies to optimize and improveDCTM is very low compared to a full 3D its thermal resistance and thermaldetailed model in Simcenter Flotherm. behaviour. Using simulations to do thisThis has a huge benefit in terms of Structure Functions Structure Functions1e+06 1e+06 1e+06 1e+06100000 100000 100000 10000010000 10000 10000 10000 Thermal Capacitance (Ws/K) Capacitance / Resistance (W^2s/K^2)Thermal Capacitance (Ws/K) Capacitance / Resistance (W^2s/K^2)1000 1000 1000 1000100 100 100 10010 10 10 101 1 1 10.1 0.1 0.1 0.10.01 0.01 0.01 0.010.001 0.001 0.001 0.0010.0001 T3STER results 0.0001 0.0001 T3STER results 0.0001Flotherm results Flotherm results1e-05 1e-05 1e-05 1e-0500.10.20.30.40.50.60.7 00.10.20.30.40.50.60.7 Thermal Resistance (K/W)Thermal Resistance (K/W)Figure 5: HFCBGA structure function curves before and after calibrationStructure Functions Structure Functions1e+06 1e+06 1e+06 1e+06100000 100000 100000 10000010000 10000 10000 10000 Thermal Capacitance (Ws/K) Capacitance / Resistance (W^2s/K^2)Thermal Capacitance (Ws/K) Capacitance / Resistance (W^2s/K^2)1000 1000 1000 1000100 100 100 10010 10 10 101 1 1 10.1 0.1 0.1 0.10.01 0.01 0.01 0.010.001 0.001 0.001 0.0010.0001 0.0001 0.0001 0.00011e-05 T3STER results 1e-05 1e-05 T3STER results 1e-05Flotherm results Flotherm results1e-06 1e-06 1e-06 1e-060246810121416 02468101214 Thermal Resistance (K/W)Thermal Resistance (K/W)Figure 6: QFN structure function curves before and after calibration69'