b'Electronics & Semiconductor | Engineer Innovationof the two packages, the percentage differences between the detailed andQFN,2.5WDCTMs are very good. The differences are below 10 percent, as shown in theHFCBGA,100Wcomparison in Figure 11.ConclusionsWith the Simcenter T3STER thermal resistance measurements, ASE are able to quickly provide the important thermal metrics and accurate DCTMs of IC packages. Using the structure functions ASE are able to quantify the internal structure within the package. The calibrated detailed Simcenter Flotherm models can also be used to further optimize the geometry of IC packages. Consequently, this new workflow is able to provide added value to the design team and ASEs customers. nFigure 10: Simcenter Flotherm model of an Access Point RouterSystem Level120-3.3%100Junction Temperature (C)80HFCBGA-DCTM 60-5.2% HFCBGA-DetailedQFN DCTM40 QFN Detailed2000 20 40 60 80Time(s)Figure 11: Transient response of detailed and dynamic compact thermal models of the QFN and HFCBGA packages in the AP RouterWith a calibrated Simcenter Flotherm model it is quick and easy to carry out design studies to optimize and improve its thermal resistance and thermal behaviour. 71'